We are seeking a Principal Mechanical and Thermal Engineer to lead the hardware definition of our next-generation AI infrastructure. This is a high-impact leadership role where you will serve as the primary technical authority for the physical architecture of advanced server platforms. You will bridge the critical gap between ultra-high-power silicon packaging, liquid-cooled node design, and massive-scale Rack deployments.

• Blade & Chassis Design: Lead the end-to-end mechanical definition of server blades, high-density chassis, and rack-level enclosures.
• Structural Hardware: Architect the integration of sliding rails, blind-mate connectors, precision standoffs, and high-load Extraction Handles.
• Power & Interconnects: Define mechanical paths for ultra-high-density power delivery (Busbars) and complex cable management.
• Cold Plate Engineering: Direct the design of Liquid Cooling Cold Plates, optimizing internal micro-channels and manifold fluid distribution.
• Fluid Management: Validate the selection and integration of Quick Disconnects (QDs) and leak-mitigation systems.
• Simulation: Drive thermal strategy for 1kW+ nodes using CFD to balance hybrid air/liquid cooling.
• HVM Mastery: Optimize designs for high-volume manufacturing using Precision Milling, Die Casting, and Complex Sheet Metal fabrication.
• Environmental Ruggedization: Ensure system integrity against Transportation Shock & Vibration and extreme Thermal/Humidity cycling.
• Total Lifecycle Design: Implement Design for Cost (DfC) and Easy Assembly (DFA) to ensure seamless serviceability and global deployment.

• Education: B.S. or M.S. in Mechanical Engineering.
• Experience: 12+ years in high-performance compute (HPC), AI hardware, or datacenter systems.
• Architectural Pedigree: A proven track record of owning at least one full product lifecycle-from blank-page concept through High-Volume Manufacturing (HVM).
• Liquid Cooling Expertise: Deep technical knowledge of fluid dynamics, wetted material compatibility, and the mechanical nuances of Drip-Free connector integration.
• Manufacturing Mastery: Expert-level understanding of metal fabrication (Milling, Casting, Sheet Metal) and how these processes impact thermal performance and structural integrity.
• Simulation Proficiency: Expert user of CFD and FEA tools for structural and vibration analysis.
• Influence: Ability to drive technical alignment across silicon, power, and optical engineering teams.

• Direct experience with AI/GPU-based architectures and ultra-high-density power delivery
• Deep familiarity with Open Compute Project (OCP) or ORV3 standards.
• Experience with blind-mate liquid and power interfaces.